China Nonferrous Metallurgy

Electrolytic copper foil has been widely used in the field of new energy because of its advantages of high strength and good ductility. At present, there are few studies on the factors affecting the performance of 5μm electrolytic copper foil. In this paper, the effects of PEG, HVP, HP and other additives on Cu electrodeposition were investigated by single variable method. The effects of PEG, HVP and HP compound additives on the performance of 5μm electrolytic copper foil were investigated by orthogonal test, and the effects of different additives on the appearance of 5μm electrolytic copper foil were compared. The following conclusions were reached: PEG and HVP can enhance the polarization, and the polarization increases with the increase of the concentration. HP can depolarization, and the depolarization increases with the increase of the concentration. The optimal concentration of the compound additive was PEG 0.36g/L, HVP 0.12g/L and HP 0.05g/L, and the best properties were tensile strength 485.17MPa, elongation 3.72% and roughness 1.31. Compared with a single additive, the surface of the composite coating under the optimal ratio of composite additive is more uniform and smooth, and the particles are fine.