Abstract:High purity sputtering targets are used as consumables in wafer foundries and LCD panel companies. The utilization rate of high purity sputtering target is low. The utilization rate of general flat targets is less than 30%, and it is difficult for rotating targets to exceed 70%. It is of great economic value and environmental significance to recycle the sputtered residual target. The research status of recovery of high purity target materials such as precious metals, ITO, titanium, tantalum, aluminum and copper were reviewed, and common problems in the recovery process of target materials were summarized. At present, there are still problems that need to be overcome and improved in the residual target recovery of high-purity target materials, such as low metal recovery rate, low purity of recovery, and long process flow, so the author anticipates that developing shorter process, environment-friendly process and exploring high-value uses are the directions for the improvement and development of high-purity residual target recycling and reuse technology in the future.